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AD7147A датащи(PDF) 38 Page - Analog Devices |
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AD7147A датащи(HTML) 38 Page - Analog Devices |
38 / 69 page AD7147A Rev. B | Page 37 of 68 PCB DESIGN GUIDELINES CAPACITIVE SENSOR BOARD MECHANICAL SPECIFICATIONS Table 20. Parameter Symbol Min Typ Max Unit Distance from Edge of Any Sensor to Edge of Grounded Metal Object D1 0.1 mm Distance Between Sensor Edges1 D2 = D3 = D4 0 mm Distance Between Bottom of Sensor Board and Controller Board or Grounded Metal Casing2 D5 1.0 mm 1 The distance is dependent on the application and the position of the switches relative to each other and with respect to the user’s finger position and handling. Adjacent sensors with no space between them are implemented differentially. 2 The 1.0 mm specification is intended to prevent direct sensor board contact with any conductive material. This specification, however, does not guarantee an absence of EMI coupling from the controller board to the sensors. To avoid potential EMI-coupling issues, place a grounded metal shield between the capacitive sensor board and the main controller board, as shown in Figure 57. SLIDER BUTTONS CAPACITIVE SENSOR PRINTED CIRCUIT D1 D3 D4 8-WAY SWITCH METAL OBJECT D2 Figure 55. Capacitive Sensor Board, Top View D5 CAPACITIVE SENSOR BOARD CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING Figure 56. Capacitive Sensor Board, Side View D5 CAPACITIVE SENSOR BOARD GROUNDED METAL SHIELD CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING Figure 57. Capacitive Sensor Board with Grounded Shield WLCSP PACKAGE Nonsolder mask definer PCB fabrication is recommended to increase the reliability of the solder joint. The copper pad on the user’s PCB should be 80% of the diameter of the WLCSP ball. The solder mask opening should be 50 μm on either side of the copper pad. See the AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale Package, for more information and layout guidelines for the WLCSP package. |
Аналогичный номер детали - AD7147A |
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Аналогичное описание - AD7147A |
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