10

REV. 1.0.5 7/22/04

FAN5009

PRODUCT SPECIFICATION

5.

The paddle on the MLP package is internally referenced

to ground. It can be left floating or connected to ground.

For best thermal performance it should be connected to

ground as shown in Figure 7.

Figure 7. Recommended layout for MLP package.

Also accepts SO8 package (not to scale)

6.

The recommended land pattern shown in the MLP

mechanical dimensions will work with both MLP-8

and SO-8 packages.

The circuit in Figure 1 illustrates a typical implementation

applications. For a complete VR10 design example, please

refer to the FAN5019 or FAN5018 datasheets.

1

2

3

4

8

7

6

5

C

BOOT

C

VCC

GROUND

VIAS

PADDLE