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KAT-4-D датащит (Datasheet) 3 Page - Mini-Circuits

№ деталь KAT-4-D
подробность  Fixed Attenuator Die
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производитель  MINI [Mini-Circuits]
домашняя страница  http://www.minicircuits.com
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Fixed Attenuator Die
Page 3 of 4
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
KAT-4-D+
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC GaAs Attenuator dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should
be opened in clean room conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed
collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or
Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total die
periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic die pick up
tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic
bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is
pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to the package or substrate. All bond wires should be kept as short as
low as reasonable to minimize performance degradation due to undesirable series inductance.
RF-IN
RF-Out
Ground
Ground
Assembly Diagram
(Ground Bond Wires are optional)
Absolute Maximum Ratings
Operating Temperature (ground)
-40°C to 85°C
RF Input Power
1.7W
Permanent damage may occur if any of these limits are exceeded.
Electrical Specifications at 25°C, 50Ω
Parameter
Condition (GHz)
Min.
Typ.
Max.
Unit
Frequency Range
DC
43.5
GHz
Attenuation1
DC - 5
4.0±0.1
dB
5 - 15
4.0±0.1
15 - 18
4.0±0.1
18 - 26.5
3.9±0.2
26.5 - 43.5
3.6±0.7
VSWR1
DC - 5
1.1
:1
5 - 15
1.2
15 - 18
1.2
18 - 26.5
1.2
26.5 - 43.5
1.2
Operating Input Power at2 :
25°C
DC - 43.5
1.7
W
85°C
DC - 43.5
1
W
1. Electrical specifications are typical measured characteristics on die using MPI Titan Series 250 µm pitch GSG probe.
2. Tested in industry standard 2x2 mm, 6-lead MCLP package.




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