поискавой системы для электроныых деталей |
|
CS5233-3GDP5 датащи(PDF) 9 Page - ON Semiconductor |
|
CS5233-3GDP5 датащи(HTML) 9 Page - ON Semiconductor |
9 / 12 page CS5233−3 http://onsemi.com 9 the ambient air ( qJA in °C per watt) and junction temperature (TJ in °C). The maximum junction temperature is calculated from the formula below: TJ(MAX) + TA(MAX) ) qJA PD(MAX) Maximum ambient temperature and power dissipation are determined by the design, while qJA is dependent on the package manufacturer. The maximum junction temperature for operation of the CS5233−3 within specification is 150 °C. The maximum power dissipation of a linear regulator is given as PD(MAX) + (VIN(MAX) * VOUT(MIN)) ILOAD(MAX) ) VIN(MAX) IGND(MAX) where IGND(MAX) is the IC bias current. It is possible to change the effective value of qJA by adding a heatsink to the design. A heatsink serves in some manner to raise the effective area of the package, thus improving the flow of heat from the package into the surrounding air. Each material in the path of heat flow has its own characteristic thermal resistance, all measured in °C per watt. The thermal resistances are summed to determine the total thermal resistance between the die junction and air. There are three components of interest: junction−to−case thermal resistance ( qJC), case−to−heatsink thermal resistance (qCS) and heatsink−to−air thermal resistance ( qSA). The resulting equation for junction−to−air thermal resistance is qJA + qJC ) qCS ) qSA,or qJA + qJC ) qSA for qCS + 0 The value of qJC for the CS5233−3 is provided in the Packaging Information section of this data sheet. qCS can be considered zero, since heat is conducted out of the package by the IC leads and the tab of the D2PAK package, and since the IC leads and tab are soldered directly to the PC board. Modification of qSA is the primary means of thermal management. For surface mount components, this means modifying the amount of trace metal that connects to the IC. The thermal capacity of PC board traces is dependent on how much copper area is used, if the IC is in direct contact with the metal, whether the metal surface is coated with some type of sealant, and whether there is airflow across the PC board. The chart provided below shows heatsinking capability of a square, single sided copper PC board trace. The area is given in square millimeters, and it is assumed there is no airflow across the PC board. Figure 12. Thermal Resistance Capability of Copper PC Board Metal Traces PC Board Trace Area (mm2) 70 0 2000 50 60 40 30 20 10 0 4000 6000 |
Аналогичный номер детали - CS5233-3GDP5 |
|
Аналогичное описание - CS5233-3GDP5 |
|
|
ссылки URL |
Конфиденциальность |
ALLDATASHEETRU.COM |
Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |