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CS5233-3GDP5 датащи(PDF) 9 Page - ON Semiconductor

номер детали CS5233-3GDP5
подробное описание детали  500 mA and 1.5 A, 3.3 V Dual Input Linear Regulator with Auxiliary Control
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS5233-3GDP5 датащи(HTML) 9 Page - ON Semiconductor

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CS5233−3
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9
the ambient air (
qJA in °C per watt) and junction temperature
(TJ in °C). The maximum junction temperature is calculated
from the formula below:
TJ(MAX) + TA(MAX) ) qJA
PD(MAX)
Maximum ambient temperature and power dissipation are
determined by the design, while
qJA is dependent on the
package manufacturer. The maximum junction temperature
for operation of the CS5233−3 within specification is
150
°C. The maximum power dissipation of a linear
regulator is given as
PD(MAX) + (VIN(MAX) * VOUT(MIN))
ILOAD(MAX) ) VIN(MAX)
IGND(MAX)
where IGND(MAX) is the IC bias current.
It is possible to change the effective value of
qJA by adding
a heatsink to the design. A heatsink serves in some manner
to raise the effective area of the package, thus improving the
flow of heat from the package into the surrounding air. Each
material in the path of heat flow has its own characteristic
thermal resistance, all measured in
°C per watt. The thermal
resistances are summed to determine the total thermal
resistance between the die junction and air. There are three
components of interest: junction−to−case thermal resistance
(
qJC), case−to−heatsink thermal resistance (qCS) and
heatsink−to−air thermal resistance (
qSA). The resulting
equation for junction−to−air thermal resistance is
qJA + qJC ) qCS ) qSA,or
qJA + qJC ) qSA for qCS + 0
The value of
qJC for the CS5233−3 is provided in the
Packaging Information section of this data sheet.
qCS can be
considered zero, since heat is conducted out of the package
by the IC leads and the tab of the D2PAK package, and since
the IC leads and tab are soldered directly to the PC board.
Modification of
qSA is the primary means of thermal
management. For surface mount components, this means
modifying the amount of trace metal that connects to the IC.
The thermal capacity of PC board traces is dependent on
how much copper area is used, if the IC is in direct contact
with the metal, whether the metal surface is coated with
some type of sealant, and whether there is airflow across the
PC board. The chart provided below shows heatsinking
capability of a square, single sided copper PC board trace.
The area is given in square millimeters, and it is assumed
there is no airflow across the PC board.
Figure 12. Thermal Resistance Capability of
Copper PC Board Metal Traces
PC Board Trace Area (mm2)
70
0
2000
50
60
40
30
20
10
0
4000
6000


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