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SN74AVCH1T45YZPR датащи(PDF) 1 Page - Texas Instruments |
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SN74AVCH1T45YZPR датащи(HTML) 1 Page - Texas Instruments |
1 / 21 page SN74AVCH1T45 SINGLEBIT DUALSUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3STATE OUTPUTS SCES598C – JULY 2004 – REVISED OCTOBER 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Control Inputs VIH/VIL Levels Are Referenced to VCCA Voltage D Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range D I/Os Are 4.6-V Tolerant D Ioff Supports Partial-Power-Down Mode Operation D Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes. The SN74AVCH1T45 is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The SN74AVCH1T45 is designed so that the DIR input is powered by VCCA. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Tape and reel SN74AVCH1T45YEPR _ _ _TF_ −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) Tape and reel SN74AVCH1T45YZPR _ _ _TF_ SOT (SOT-23) − DBV Tape and reel SN74AVCH1T45DBVR ET1_ SOT (SC-70) − DCK Tape and reel SN74AVCH1T45DCKR TF_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 VCCA GND A VCCB DIR B 3 2 1 4 5 6 A GND VCCA B DIR VCCB YEP OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Аналогичный номер детали - SN74AVCH1T45YZPR |
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Аналогичное описание - SN74AVCH1T45YZPR |
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