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SN74AVCH1T45YZPR датащи(PDF) 1 Page - Texas Instruments

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номер детали SN74AVCH1T45YZPR
подробное описание детали  SINGLE BIT DUAL SUPPLY BUS TRANSCEIVER
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

SN74AVCH1T45YZPR датащи(HTML) 1 Page - Texas Instruments

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SN74AVCH1T45
SINGLEBIT DUALSUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3STATE OUTPUTS
SCES598C – JULY 2004 – REVISED OCTOBER 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Control Inputs VIH/VIL Levels Are
Referenced to VCCA Voltage
D Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
D I/Os Are 4.6-V Tolerant
D Ioff Supports Partial-Power-Down Mode
Operation
D Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVCH1T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVCH1T45 is designed so that the DIR input is powered by VCCA.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74AVCH1T45YEPR
_ _ _TF_
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Tape and reel
SN74AVCH1T45YZPR
_ _ _TF_
SOT (SOT-23) − DBV
Tape and reel
SN74AVCH1T45DBVR
ET1_
SOT (SC-70) − DCK
Tape and reel
SN74AVCH1T45DCKR
TF_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
VCCA
GND
A
VCCB
DIR
B
3
2
1
4
5
6
A
GND
VCCA
B
DIR
VCCB
YEP OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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