BC846BPDW1T1, BC847BPDW1T1 Series, BC848CPDW1T1 Series

http://onsemi.com

9

PACKAGE DIMENSIONS

SOT−363/SC−88

CASE 419B−02

ISSUE U

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

1.80

2.20

0.071

0.087

INCHES

B

1.15

1.35

0.045

0.053

C

0.80

1.10

0.031

0.043

D

0.10

0.30

0.004

0.012

G

0.65 BSC

0.026 BSC

H

−−−

0.10

−−−

0.004

J

0.10

0.25

0.004

0.010

K

0.10

0.30

0.004

0.012

N

0.20 REF

0.008 REF

S

2.00

2.20

0.079

0.087

B

12

3

A

G

S

H

C

N

J

K

65

4

−B−

STYLE 1:

PIN 1. EMITTER 2

2. BASE 2

3. COLLECTOR 1

4. EMITTER 1

5. BASE 1

6. COLLECTOR 2