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MT18N102J500CT датащит (PDF) 24 Page - WALSIN TECHNOLOGY CORPORATION

№ деталь MT18N102J500CT
подробность  A wide selection of sizes is available
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производитель  WALSIN [WALSIN TECHNOLOGY CORPORATION]
домашняя страница  http://www.passivecomponent.com/
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MT18N102J500CT Datasheet(HTML) 24 Page - WALSIN TECHNOLOGY CORPORATION

 
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Multilayer Ceramic Capacitors
Approval Sheet
Page 24 of 27
ASC_ Automotive Cap_(MT)_022N_DS
Mar. 2019
No.
AEC-Q200
Test Item
AEC-Q200 Test Condition
Requirements
18. Board Flex
AEC-Q200-005
* The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm per second until
the deflection becomes 3mm (2mm for X7R)
and then the pressure shall be maintained
for 60±1 sec.
* Measurement to be made after keeping at
room temp. for 24±2 hrs.
* No remarkable damage.
* Cap change: NPO: within ±5% or 0.5pF whichever is larger
X7R: within ±12.5%
(This capacitance change means the change of capacitance under specified flexure of
substrate from the capacitance measured before the test.)
19. Terminal Strength
AEC-Q200-006
* Pressurizing force:2N (0201 & 0402),
10N(0603), 18N(≥0805).
* Test time: 60±1 sec.
* No remarkable damage or removal of the terminations.
* Capacitance within the specified tolerance.
*
Q/D.F. value:
NPO: Cap
≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
X7R:
Rated
vol.
D.F ≦
.
Exception of D.F.
100V ≦2.5%
3%
1206
0.47
µF
5%
0603≧0.068
µF;0805>0.1µF;1206≧1µF;1210≧2.2µF
10%
0805>0.22µF;
1210
3.3
µF
50V
2.5%
3%
0201(50V); 0603 0.047µF; 0805 0.18µF;1206 0.47µF
5%
0201
0.01uF; 1210 4.7µF
10%
0402≧0.012
µF;0603>0.1µF; 0805>0.47µF;
1206≧2.2
µF;1210≧10µF
35V
3.5% ≦10%
0603≧
1µF;0805≥2.2 F;1206 2.2µF;1210 10µF
25V
3.5%
5%
0201≧0.01
µF;0805≧1µF;1210≧10µF
7%
0603≧0.33
µF
10%
0201
0.1µF; 0402≧0.056µF;0603≧0.47µF;
0805≧2.2
µF; 1206≧4.7µF; 1210≧22µF
12.5% 040 ≧
2
0.47
µF
16V
3.5%
5%
0201
0.01µF;0402 0.033µF;0603 0.15µF;
0805
0.68µF;1206 2.2µF;1210 4.7µF
10%
0201≧0.022
µF; 0402≧ 0.22uF;0603>0.47µF;
0805≧2.2
µF;1206≧4.7µF; 1210≧22µF
10V
5%
10%
0201≧0.012
µF;0402≧0.22µF;0603≧0.33µF;
0805≧2.2
µF;1206≧2.2µF;1210≧22µF
15%
0201
0.1µF; 0402 1µF
6.3V
10%
15%
0201
0.1µF;0402 1µF;0603 10µF;
0805≧4.7
µF; 1206≧47µF :1210≧100µF
20%
0402
2.2
µF
4V
15%
---
---
20 Beam Load Test
AEC-Q200-003
* Break strength test
* Beam speed: 2.5±0.25 mm/sec
The chip endure following force
* Chip length
≤2.5mm: Thickness >0.5mm (20N), ≤0.5mm (8N)
* Chip length
≥3.2mm: Thickness ≥1.25mm (54.5N), <1.25mm (15N)


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