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CDCDB2000 датащит (PDF) 30 Page - Texas Instruments

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№ деталь CDCDB2000
подробность  CDCDB2000 DB2000QL-Compliant 20-Output Clock Buffer for PCIe Gen 1 to Gen 5
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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CDCDB2000 Datasheet(HTML) 30 Page - Texas Instruments

 
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CDCDB2000
SNAS787 – NOVEMBER 2019
www.ti.com
Product Folder Links: CDCDB2000
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Device Support
11.1.1 TICS Pro
TICS Pro is an offline software tool for EVM programming and also for register map generation to program a
device configuration for a specific application. For TICS Pro, go to http://www.ti.com/tool/TICSPRO-SW.
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.


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