PRODUCT SPECIFICATION

ILC7071

REV. 1.0.2 7/16/03

9

General PCB Layout Considerations

To achieve the full performance of the device, careful circuit

layout and grounding technique must be observed. Establish-

ing a small local ground, to which the GND pin, the output

and bypass capacitors are connected, is recommended, while

the input capacitor should be grounded to the main ground

plane.

The quiet local ground is then routed back to the main

ground plane using feedthrough vias.

In general, the high frequency compensation components

(input, bypass, and output capacitors) should be located as

close to the device as possible.

The proximity of the output capacitor is especially important

to achieve optimal noise compensation from the onboard

error amplifier, especially during high load conditions.

A large copper area in the local ground will provide the heat

sinking discussed above when high power dissipation signif-

icantly increases the temperature of the device.

Component-side copper provides significantly better thermal

performance for this surface-mount device, compared to that

obtained when using only copper planes on the underside.