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MMG3005NT1 датащит (PDF) 18 Page - NXP Semiconductors

№ деталь MMG3005NT1
подробность  Heterojunction Bipolar Transistor Technology (InGaP HBT)
скачать  20 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
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MMG3005NT1 Datasheet(HTML) 18 Page - NXP Semiconductors

 
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18
RF Device Data
Freescale Semiconductor
MMG3005NT1
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3100: General Purpose Amplifier Biasing
 AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation
Software
 .s2p File
Development Tools
 Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
3
Mar. 2007
 Replaced Case Outline 1543--02 with updated 1543--03, Issue C, pp. 1, 16--18
 Added VCC callout to Pin Connections 10, 11, and 12 in Fig. 1, Pin Connections, p. 3
 Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part
numbers, p. 5
 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 5, 50 Ohm Test Circuit Component
Layout, 900 MHz, p. 6
 Removed IDC value due to its variability over temperature, Figs. 12--13, IS--95 Adjacent Channel Power
Ratio versus Output Power, 900 MHz, p. 8
 Updated Part Numbers in Table 9, Component Designations and Values, 1800--2200 MHz, to RoHS
compliant part numbers, p. 9
 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 15, 50 Ohm Test Circuit Component
Layout, 1800--2200 MHz, p. 10
 Removed IDC value due to its variability over temperature, Figs. 22--23, IS--95 Adjacent Channel Power
Ratio versus Output Power, 1800--2200 MHz, and Fig. 24, Single--Carrier W--CDMA Adjacent Channel
Power Ratio versus Output Power, 1800--2200 MHz, p. 12
 Added Product Documentation and Revision History, p. 19
4
Feb. 2008
 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
 Changed Table 4, Electrical Characteristics Supply Current Min value from 455 mA to 420 mA, p. 2
 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 13, 14
5
Apr. 2008
 Corrected Tape and Reel information from 12 mm, 7--inch Reel to 16 mm, 13--inch Reel, p. 1
 Corrected Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 12
6
June 2009
 Replaced Case Outline 1543--03, Issue C, with 1543--04, Issue D, pp. 1, 16--18. Corrected I/O dimension
from 0.95--1.2 mm to 0.925--1.175 mm.
 Corrected temperature at which ThetaJC is measured from 25C to 100C, Thermal Characteristics
table, p. 1
7
May 2010
 Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current, p. 4
 Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat
Dissipation, Application Notes, p. 19
 Added .s2p File availability to Product Software, p. 19


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