MLCC Product Manual

4-6. Soldering Iron

Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature

soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the

carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close

attention must be paid to the selection of the soldering iron tip and to temperature control of the

tip.

4-6-1. How to use a soldering Iron

· In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.

A hot plate and a hot air type preheater should be used for preheating

. Do not cool down MLCC and PCB rapidly after soldering.

· Keep the contact time between the outer termination of MLCC and the soldering iron as short as

possible. Long soldering time may cause problems such as adhesion deterioration by the

leaching phenomenon of the outer termination.

Variation of

Temp.

Soldering

Temp.(℃)

Pre-heating

Time(sec)

Soldering

Time(sec)

Cooling

Time(sec)

ΔT ≤ 130

300±10℃ max

≥60

≤4

-

* Control Δ T in the solder iron and preheating temperature.

Condition of Iron facilities

Wattage

Tip diameter

Soldering time

20W max

3 ㎜ max

4sec max

* Caution - Iron tip should not contact with ceramic body directly

Lead-free solder: Sn-3.0Ag-0.5CU

4-6-2. How to use a spot heater

Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and

the PCB, which is likely to lessen the thermal shocks.

For a high density PCB, a spot heater can prevent the problem to connect between a solder iron

and MLCC directly.

· If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the

thermal stress. Follow the conditions set in the table below to prevent this problem.

· The spot heater application angle as shown in the figure is recommended to create a suitable

solder fillet shape.

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