MIL-PRF-19500/420H
10
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer’s list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows:.
*
EC .........................End cap.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500 and on figure 1 (similar to DO-41) for 1N5550 through 1N5554, figure 2 for 1N5550US through
1N5554US, and figures 3, 4, 5, 6, and 7 (JANHC and JANKC).
3.4.1 Lead finish. Unless otherwise specified, lead or end cap finish shall be solderable in accordance with
MIL-PRF-19500, MIL-STD-750, and herein. When solder alloy is used for finish the maximum lead temperature is
limited to 175
°C maximum. Where a choice of finish is desired, it shall be specified in the acquisition document (see
6.2).
3.4.2 Diode construction. These devices shall be constructed utilizing non-cavity double plug construction with
high temperature metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond
shall be in accordance with the requirements of category I in MIL-PRF-19500. US version devices shall be
structurally identical to the non-surface mount devices except for lead terminations.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5.1 Marking of US version. For US version only, all marking may be omitted from the device except for the
cathode marking. All marking which is omitted from the body of the device shall appear on the label of the initial
container.
3.5.2 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end. Alternately
for surface mount (US) devices, a minimum of three evenly spaced contrasting color dots around the periphery of the
cathode end may be used. No color coding will be permitted.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I herein.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I
herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
b.
Screening (see 4.3).
c.
Conformance inspection (see 4.4).
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