CAUTION: The small device geometries inherent to the design of this bipolar component increase the component’s

susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken

in handling and assembly of this component to prevent damage and/or degradation which may be induced by

ESD.

Small Outline, 5 Lead, Low

Input Current, High Gain

Optocouplers

Technical Data

HCPL-M700

HCPL-M701

Description

These small outline, low input

current, high gain optocouplers

are single channel devices in a

five lead miniature footprint. They

are electrically equivalent to the

following Agilent optocouplers:

Features

• Surface Mountable

• Very Small, Low Profile

JEDEC Registered

Package Outline

• Compatible with Infrared

Vapor Phase Reflow and

Wave Soldering Processes

• High Current Transfer

Ratio - 2000%

• Low Input Current

Capability - 0.5 mA

• TTL Compatible Output -

• Guaranteed ac and dc

Performance Over

Temperature: 0

• High Output Current -

60 mA

• Recognized under the

Component Program of

U.L. (File No. E55361) for

Dielectric Withstand Proof

Test Voltage of 3750 Vac, 1

Minute

• Lead Free Option “-000E”

The SO-5 JEDEC registered (MO-

155) package outline does not

require “through holes” in a PCB.

This package occupies

approximately one-fourth the

footprint area of the standard

dual-in-line package. The lead

profile is designed to be com-

patible with standard surface

mount processes.

These high gain series opto-

couplers use a Light Emitting

Diode and an integrated high gain

photodetector to provide

extremely high current transfer

ratio between input and output.

Separate pins for the photodiode

and output stage results in TTL

compatible saturation voltages

and high speed operation. Where

may be tied together to achieve

conventional photodarlington

operation.

SO-5 Package

Standard DIP

SO-8 Package

HCPL-M700

6N138

HCPL-0700

HCPL-M701

6N139

HCPL-0701