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STP16CP596
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Table 4: Absolute Maximum Ratings
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Under these conditions, functional operation
is not implied.
Table 5: Thermal Data
(*) The exposed pad should be soldered directly to the PCB to realize the thermal benefits.
Table 6: Recommended Operating Conditions
Symbol
Parameter
Value
Unit
VDD
Supply Voltage
0 to 7
V
VO
Output Voltage
-0.5 to 16
V
IO
Output Current
50
mA
VI
Input Voltage
-0.4 to VDD+0.4
V
IGND
GND Terminal Current
800
mA
fCLK
Clock Frequency
25
MHz
TOPR
Operating Temperature Range
-40 to +125
°C
TSTG
Storage Temperature Range
-65 to +150
°C
Symbol
Parameter
DIP-24
SO-24
TSSOP24
TSSOP24 (*)
(exposed pad)
Unit
Rthj-amb Thermal Resistance Junction-ambient
60
75
85
37.5
°C/W
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Supply Voltage
3.0
5.5
V
VO
Output Voltage
16.0
V
IO
Output Current
OUTn
3
50
mA
IOH
Output Current
SERIAL-OUT
+1
mA
IOL
Output Current
SERIAL-OUT
-1
mA
VIH
Input Voltage
0.7VDD
VDD+0.3
V
VIL
Input Voltage
-0.3
0.3VDD
V
twLAT
/LE Pulse Width
VDD = 3.0 to 3.6V
20
ns
twCLK
CLK Pulse Width
20
ns
twEN
/OE Pulse Width
400
ns
tSETUP(D) Setup Time for DATA
20
ns
tHOLD(D)
Hold Time for DATA
15
ns
tREM(L)
Removal Time for LATCH
15
ns
fCLK
Clock Frequency
Cascade Operation
25
MHz
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