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CX77301 датащи(PDF) 9 Page - Skyworks Solutions Inc. |
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CX77301 датащи(HTML) 9 Page - Skyworks Solutions Inc. |
9 / 14 page PA Module for Dual-band EGSM900 DCS1800 / GPRS Data Sheet • CX77301 Skyworks Solutions, Inc. Proprietary Information 9 100956E [781] 376-7000 • FAX [781] 376-3100 • SALES@SKYWORKSINC.COM • WWW.SKYWORKSINC.COM SEPTEMBER 19, 2003 GND EGSMIN DCS IN GND GND GND GND GND GND GND VCC1 VCC2 EGSM OUT DCS OUT APC BS 2 3 4 5 14 16 15 13 12 11 10 9 1 100956_002 67 8 Figure Figure Figure Figure 5 5 5 5. CX77301 Package and Pin Configuration (Top View) . CX77301 Package and Pin Configuration (Top View) . CX77301 Package and Pin Configuration (Top View) . CX77301 Package and Pin Configuration (Top View) Table Table Table Table 4 4 4 4. CX77301 Pin Names and Signal . CX77301 Pin Names and Signal . CX77301 Pin Names and Signal . CX77301 Pin Names and Signal Descriptions Descriptions Descriptions Descriptions Pin Pin Pin Pin Name Name Name Name Description Description Description Description 1 GND Ground 2 DCS IN RF input to DCS PA (DC coupled) 3 GND Ground 4 EGSM IN RF input to EGSM PA 5 GND Ground 6 VCC1 Power supply for PA driver stages 7 GND Ground 8 VCC2 Power supply for PA output stages 9 GND Ground 10 EGSM OUT EGSM RF output (DC coupled) 11 GND Ground 12 DCS OUT DCS RF output (DC coupled) 13 GND Ground 14 APC Analog Power Control 15 GND Ground 16 BS Band select PACKAGE AND HANDLING PACKAGE AND HANDLING PACKAGE AND HANDLING PACKAGE AND HANDLING INFORMATION INFORMATION INFORMATION INFORMATION Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77301 is capable of withstanding an MSL 3/240 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 240 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020B. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568. |
Аналогичный номер детали - CX77301 |
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Аналогичное описание - CX77301 |
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