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SMD2920 Surface Mount PTC Devices
R.O.C. Patent#415624
PHYSICAL DIMENSIONS (mm)
A
B
C
D
E
Part Number
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Min.
Max.
SMD2920P030TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P050TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P075TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P100TS
6.73
7.98
4.80
5.44
0.55
1.00
0.30
0.25
2.00
SMD2920P125TS
6.73
7.98
4.80
5.44
0.55
1.00
0.30
0.25
2.00
SMD2920P150TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P185TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P200TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P250TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P260TS
6.73
7.98
4.80
5.44
0.55
1.00
0.30
0.25
2.00
SMD2920P300TS
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
SMD2920P300TS/15
6.73
7.98
4.80
5.44
0.75
1.25
0.30
0.25
2.00
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage
Temperature
-40℃ to +85℃
Maximum Device Surface
Temperature in Tripped State
125℃
Passive Aging
+85℃, 1000 hours
±5% typical resistance change
Humidity Aging
+85℃, 85%R.H. 1000 hours
±5% typical resistance change
Thermal Shock
MIL-STD-202 Method 107G
+85℃/-40℃ 20 times
-30% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
Vibration
MIL-STD-883C, Method 2007.1, Condition A
No change
PHYSICAL SPECIFICATIONS
Terminal Material
Solder-Plated Copper (Solder Material: 63/37 SnPb)
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Packaging
16 mm tape on 7 inch reel per EIA-481-1 (equivalent to IEC286, part 3)
2000 devices per reel for P100TS, P125TS &P260
others : 1500 devices per reel
◎ Specifications are subject to change without notice.
FIGURE
SOLDER PAD LAYOUTS
TM