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S75WS-N Based MCPs

S75WS-N_02_A2 October 6, 2005

Prel imi n ary

2

Ordering Information

The ordering part number is formed by a valid combination of the following:

Package Marking Note:

The BGA package marking omits the leading S75 and packing type designator from the ordering part number.

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult

your local sales office to confirm availability of specific valid combinations and to check on newly

released combinations.

S75WS 256 N D F BA W

L

K 0

Packing Type

0= Tray

2

= 7” Tape and Reel

3

= 13” Tape and Reel

RAM Supplier; Speed Combination

K

= RAM Type 4, 54 MHz

J

= RAM Type 4, 66 MHz

H

= RAM Type 4, 80 MHz

Package Dimensions and Ball Count; DYB Power Up;

Flash Device Family (Data Storage)

L

= 1.4 mm, 9 x 12, 84 ball; 0, WS as Data Flash

N

= 1.4 mm, 9 x 12, 84 ball; 1, WS as Data Flash

U

= 1.4mm, 11x13, 115-ball, x16 ORNAND Data Flash

S

= 1.4mm, 11x13, 115-ball, x8 ORNAND Data Flash

Temperature Range

W

= Wireless (–25°C to +85°C)

Package Type And Material

BA

= Very Thin Fine-Pitch Ball Grid Array (BGA),

Lead (Pb)-free Compliant Package

BF

= Very Thin Fine-Pitch Ball Grid Array (BGA),

Lead (Pb)-free Package

Data Flash Density

F

= 512 Mb

G

= 1024 Mb

RAM Density

D

= 128 Mb

E

= 256 Mb

Process Technology

N

= 110 nm, Mirror Bit Technology

Code Flash Density

256

= 256 Mb

Device Family

S75WS = Multi-chip Product (MCP)

1.8-volt Burst Mode Flash Memory, RAM, and data flash

Table 2.1 MCP Configurations and Valid Combinations

Valid Combination

S75WS256N

D

F

BA, BF

W

L, N

K, H

Table 2.2 ORNAND Configurations and Valid Combinations

Valid Combination

S75WS256N

E

G

BA, BF

W

U, S

K, J, H