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CS5253B-1 датащи(PDF) 9 Page - ON Semiconductor

номер детали CS5253B-1
подробное описание детали  3.0 A LDO 5-Pin Adjustable Linear Regulator with Remote Sense Applications
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
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CS5253B-1 датащи(HTML) 9 Page - ON Semiconductor

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capacitance and the input voltage is instantaneously shorted
to ground, damage can occur. In this case, a diode connected
as shown in Figure 22 is recommended.
Figure 22. Diode Protection Circuit
CS5253B−1
VCONTROL
VPOWER
VOUT
VSENSE
Adjust
A rule of thumb useful in determining if a protection diode
is required is to solve for current:
I
+ C
V
T
where:
I is the current flow out of the load capacitance when
VCONTROL is shorted,
C is the value of load capacitance
V is the output voltage, and
T is the time duration required for VCONTROL to transition
from high to being shorted.
If the calculated current is greater than or equal to the
typical short circuit current value provided in the
specifications, serious thought should be given to the use of
a protection diode.
Current Limit
The internal current limit circuit limits the output current
under excessive load conditions.
Short Circuit Protection
The device includes short circuit protection circuitry that
clamps the output current at approximately 500 mA less than
its current limit value. This provides for a current foldback
function, which reduces power dissipation under a direct
shorted load.
Thermal Shutdown
The thermal shutdown circuitry is guaranteed by design to
activate above a die junction temperature of approximately
150
°C and to shut down the regulator output. This circuitry
has 25
°C of typical hysteresis, thereby allowing the
regulator to recover from a thermal fault automatically.
Calculating Power Dissipation and
Heatsink Requirements
High power regulators such as the CS5253B−1 usually
operate at high junction temperatures. Therefore, it is
important to calculate the power dissipation and junction
temperatures accurately to ensure that an adequate heatsink
is used. Since the package tab is connected to VOUT on the
CS5253B−1, electrical isolation may be required for some
applications. Also, as with all high power packages, thermal
compound in necessary to ensure proper heat flow. For
added safety, this high current LDO includes an internal
thermal shutdown circuit
The thermal characteristics of an IC depend on the
following four factors: junction temperature, ambient
temperature, die power dissipation, and the thermal
resistance from the die junction to ambient air. The
maximum junction temperature can be determined by:
TJ(max) + TA(max) ) PD(max)
R
qJA
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max) + (VIN(max) * VOUT(min))IOUT(max)
) VIN(max)
IIN(max)
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance which is measured in degrees per watt. Like series
electrical resistances, these thermal resistances are summed
to determine the total thermal resistance between the die
junction and the surrounding air, RqJA. This total thermal
resistance is comprised of three components. These resistive
terms are measured from junction−to−case (RqJC),
case−to−heatsink (RqCS), and heatsink−to−ambient air
(RqSA). The equation is:
R
qJA + RqJC ) RqCS ) RqSA
The value for RQJC is 2.5°C/watt for the CS5253B−1 in
the D2PAK−5 package. For a high current regulator such as
the CS5253B−1 the majority of heat is generated in the
power transistor section. The value for RqSA depends on the
heatsink type, while the RqCS depends on factors such as
package type, heatsink interface (is an insulator and thermal
grease used?), and the contact area between the heatsink and
the package. Once these calculations are complete, the
maximum permissible value of RqJA can be calculated and
the proper heatsink selected. For further discussion on
heatsink selection, see our application note “Thermal
Management,” document number AND8036/D.


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