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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP1653-EVALZ1 датащи(PDF) 6 Page - Analog Devices |
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ADP1653-EVALZ1 датащи(HTML) 6 Page - Analog Devices |
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6 / 24 page  ADP1653 Rev. A | Page 6 of 24 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VDD, CTRL0/SDA, CTRL1/SCL, INTF, EN, SETI, SETT, SETF, STR, HPLED to GND −0.3 V to +6 V INT, ILED to GND −0.3 V to + (VDD + 0.3 V) LX, OUT to GND −0.3 V to +12 V PGND to GND −0.3 V to +0.3 V Operating Ambient Temperature Range −40°C to +125°C1 Operating Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 1 In applications where high power dissipation and poor thermal resistance are present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(MAX)) is dependent on the maximum operating junction temperature (TJ(MAXOP) = 125°C), the maximum power dissipation of the device (PD(MAX)), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), using the following equation: TA(MAX) = TJ(MAXOP) – (θJA x PD(MAX)). Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. THERMAL RESISTANCE Junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is dependent on the application and board layout. In applications where high maximum power dissipation exists, attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. For more information, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). Table 4. Thermal Resistance Package Type θJA Unit 16-Lead LFCSP 44 °C/W Maximum Power Dissipation 1 W BOUNDARY CONDITION Natural convection, 4-layer board, exposed pad soldered to the PCB. ESD CAUTION |
Аналогичный номер детали - ADP1653-EVALZ1 |
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Аналогичное описание - ADP1653-EVALZ1 |
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