CS4122

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9

PACKAGE DIMENSIONS

SOIC−24 WB

DWF SUFFIX

CASE 751E−04

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

−A−

−B−

P

12X

D

24X

12

13

24

1

M

0.010 (0.25)

S

A

M

0.010 (0.25)

T

−T−

G

22X

SEATING

PLANE

K

C

_

M

F

J

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

15.25

15.54

0.601

0.612

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.41

0.90

0.016

0.035

G

1.27 BSC

0.050 BSC

J

0.23

0.32

0.009

0.013

K

0.13

0.29

0.005

0.011

M

0

8

0

8

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

_

_

_

_

PACKAGE THERMAL DATA

Parameter

SOIC−24 WB

Unit

Typical

9

°C/W

Typical

55

°C/W

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