NBSG11

http://onsemi.com

8

Table 8. AC CHARACTERISTICS for FCBGA−16

Symbol

Characteristic

−40

°C

25

°C

70

°C

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Maximum Frequency

10.709

12

10.709

12

10.709

12

GHz

Propagation Delay to

Output Differential

90

125

160

90

125

160

90

125

160

ps

Duty Cycle Skew (Note 23)

Within−Device Skew (Note 24)

Device−to−Device Skew (Note 25)

3

6

25

15

15

50

3

6

25

15

15

50

3

6

25

15

15

50

ps

RMS Random Clock Jitter

Peak−to−Peak Data Dependent Jitter

0.2

TBD

1

0.2

TBD

1

0.2

TBD

1

ps

Input Voltage Swing/Sensitivity

(Differential Configuration) (Note 26)

75

2600

75

2600

75

2600

mV

Output Rise/Fall Times

Q, Q

(20% − 80%) @ 1 GHz

20

30

55

20

30

55

20

30

55

ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

22. Measured using a 500 mV source, 50% duty cycle clock source. All loading with 50

output amplitude is approximately 200 mV (as shown in Figure 4, where output P−P spec is shown as a minimum/guarantee of around

150 mV). Input edge rates 40 ps (20% − 80%).

24. Within−Device skew is defined as identical transitions on similar paths through a device.