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AD8224ACPZ-R7 датащи(PDF) 9 Page - Analog Devices

номер детали AD8224ACPZ-R7
подробное описание детали  Precision, Dual-Channel, JFET Input Rail-to-Rail Instrumentation Amplifier
Download  28 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD8224ACPZ-R7 датащи(HTML) 9 Page - Analog Devices

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AD8224
Rev. 0 | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
Supply Voltage
±18 V
Power Dissipation
See Figure 2
Output Short Circuit Current
Indefinite1
Input Voltage (Common Mode)
±Vs
Differential Input Voltage
±Vs
Storage Temperature
−65°C to +130°C
Operating Temperature Range2
−40°C to +125°C
Lead Temperature Range (Soldering, 10 sec)
300°C
Junction Temperature
130°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
4 kV
ESD (Charge Device Model)
1 kV
ESD (Machine Model)
0.4 kV
1 Assumes the load is referenced to mid supply.
Temperature for specified performance is −40°C to +85°C. For performance
to +125°C, see the
2
Typical Performance Characteristics section.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
THERMAL RESISTANCE
Table 9.
Thermal Pad
θJA
Unit
Soldered to Board
48
°C/W
Not Soldered to Board
86
°C/W
The θJA values in Table 9 assume a 4-layer JEDEC standard
board. If the thermal pad is soldered to the board, then it is
also assumed it is connected to a plane. θJC at the exposed pad
is 4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8224 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP on a 4-layer
JEDEC standard board.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–60
–40
–20
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE (°C)
θJA = 48°C/W WHEN THERMAL PAD
IS SOLDERED TO BOARD
θJA = 86°C/W WHEN THERMAL PAD
IS NOT SOLDERED TO BOARD
Figure 2. Maximum Power Dissipation
ESD CAUTION


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