10

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FN6277.0

September 21, 2006

ISL59116

Wafer Level Chip Scale Package (WLCSP)

PIN A1 ID AREA

A

E1

BOTTOM VIEW

A

B

12

C

3

b

SIDE VIEW

b

TOP VIEW

bb

D

E

SD

W3x3.9A

3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE

(For ISL59116, ISL59117 Only)

SYMBOL

MILLIMETERS

NOTES

A

0.62 +0.05 -0.08

-

0.24 ±0.025

-

0.38 REF.

-

b

0.32 ±0.03

-

bb

θ 0.30 REF.

-

D

1.45 ±0.05

-

1.00 BASIC

-

E

1.45 ±0.05

-

1.00 BASIC

-

e

0.50 BASIC

-

SD

0.00 BASIC

-

N9

3

Rev. 1 6/06

NOTES:

1. Dimensions are in Millimeters.

2. Dimensioning and tolerancing conform to ASME 14.5M-1994.

3. Symbol “N” is the actual number of solder balls.

4. Reference JEDEC MO-211-C, variation DD.