If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Input Voltage

−26V to +0.3V

ESD Susceptibility (Note 2)

2 kV

Power Dissipation (Note 3)

Internally limited

Junction Temperature (T

125˚C

Storage Temperature Range

−65˚C to +150˚C

Lead Temperature (Soldering, 10 sec.)

230˚C

Junction Temperature Range (T

−40˚C to +125˚C

Maximum Input Voltage (Operational)

−26V

Electrical Characteristics

V

the entire operating junction temperature range.

Parameter

Conditions

Typical

Min

Max

Units

(Note 4)

Reference Voltage

5 mA

≤ I

−1.210

−1.234

−1.186

V

5mA

≤ I

−1.27

−1.15

V

V

Output Voltage

−2

−3

V

Range

V

−25

−24

V

Line Regulation

I

0.004

0.04

%/V

Load Regulation

50 mA

≤ I

0.04

0.4

%

Dropout Voltage

I

0.1

0.2

V

0.3

I

0.6

0.8

V

1

Quiescent Current

I

0.7

5

mA

Dropout Quiescent

V

16

50

mA

Current

Ripple Rejection

V

60

50

dB

I

Output Noise

10 Hz − 100 kHz, I

200

450

µV

ON /OFF Input

(V

1.2

0.8

V

Voltage

(V

1.3

2.4

ON /OFF Input

V

0.1

10

µA

Current

V

40

100

Output Leakage

V

60

250

µA

Current

V

Current Limit

V

2

1.5

A

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the deivce is in-

tended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

junction-to-ambient thermal resistance is 53˚C/W for the TO-220, 73˚C/W for the TO-263, and junction-to-case thermal resistance is 3˚C. If the TO-263 package is

used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area,

www.national.com

3