поискавой системы для электроныых деталей |
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BAS116H датащи(PDF) 6 Page - NXP Semiconductors |
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BAS116H датащи(HTML) 6 Page - NXP Semiconductors |
6 / 9 page 9397 750 14881 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 11 April 2005 6 of 9 Philips Semiconductors BAS116H 75 V, low leakage diode in small SOD123F package 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 16. 11. Soldering Fig 6. Package outline SOD123F 04-11-29 Dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 Table 8: Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 3000 10000 BAS116H SO123F 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD123F 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste |
Аналогичный номер детали - BAS116H |
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Аналогичное описание - BAS116H |
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