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STA210N датащи(PDF) 4 Page - STMicroelectronics |
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STA210N датащи(HTML) 4 Page - STMicroelectronics |
4 / 6 page Package information STA210N 4/6 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com. Figure 2. VFQFPN68 mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A1 0.02 0.05 0.0008 0.0020 A2 0.65 1.00 0.0256 0.0394 A3 0.20 0.0079 b 0.18 0.25 0.30 0.0071 0.0098 0.0118 D 9.85 10.00 10.15 0.3878 0.3937 0.3996 D1 9.75 0.3839 D2 7.55 7.7 7.85 0.2972 0.3031 0.3091 E 9.85 10.00 10.15 0.3878 0.3937 0.3996 E1 9.75 0.3839 E2 7.55 7.7 7.85 0.2972 0.3031 0.3091 e 0.50 0.0197 L 0.45 0.55 0.65 0.0177 0.0217 0.0256 P 0.60 0.0236 ddd 0.08 0.0031 VFQFPN68 (10x10x1.0mm, pitch 0.50) Very Fine Quad Flat Package No lead 7479590_C |
Аналогичный номер детали - STA210N |
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Аналогичное описание - STA210N |
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