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TLP4197G датащи(PDF) 2 Page - Toshiba Semiconductor

номер детали TLP4197G
подробное описание детали  PBX Telecommunication Modem FAX Cards, Modems In PC Measurement Instrumentation
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP4197G датащи(HTML) 2 Page - Toshiba Semiconductor

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TLP4197G
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Forward current
IF
50
mA
Forward current derating
(Ta >= 25°C)
ΔIF/°C
−0.5
mA/°C
Peak forward current
(100
μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Off-state output terminal voltage
VOFF
350
V
A connection
120
B connection
120
On-state current
C connection
ION
240
mA
A connection
−1.2
B connection
−1.2
On-state current
derating
(Ta >= 25°C)
C connection
ΔION/°C
−2.4
mA/°C
Junction temperature
Tj
125
°C
Operating temperature range
Topr
−40 to 85
°C
Storage temperature range
Tstg
−55 to 125
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage
(AC, 1 min, R.H. <= 60%)
(Note 1)
BVS
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: LED side pins shorted together, and DETECTOR side pins and 6
shorted together.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
280
V
Forward current
IF
5
25
mA
On-state current
ION
120
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
A Connection
B Connection
C Connection
1
2
3
6
5
4
LOAD
AC
or
DC
1
2
3
6
5
4
LOAD
DC
1
2
3
6
5
4
LOAD
DC


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