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TLP597G датащи(PDF) 2 Page - Toshiba Semiconductor

номер детали TLP597G
подробное описание детали  Cordless Telephone
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP597G датащи(HTML) 2 Page - Toshiba Semiconductor

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TLP597G
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
IF
50
mA
Forward current derating (Ta ≥ 25°C)
ΔIF / °C
−0.5
mA / °C
Peak forward current (100 μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Off
−state output terminal voltage
VOFF
350
V
A connection
120
B connection
120
On
−state RMS current
C connection
ION
160
mA
A connection
−1.2
B connection
−1.2
On
−state current derating
(Ta ≥ 25°C)
C connection
ΔION / °C
−1.6
mA / °C
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−40~85
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage (AC, 1 min., R.H.≤ 60%)
(Note 1)
BVS
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1): Device considered a two
−terminal device: Pins 1, 2 and 3 shorted together and pins 4, 5 and 6
shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
VDD
280
V
Forward current
IF
5
7.5
25
mA
On
−state current
ION
120
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
A connection
B connection
C connection
~
LOAD
AC or DC
1
2
3
4
5
6
LOAD
DC
1
2
3
4
5
6
LOAD
DC
1
2
3
4
5
6


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