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TLP554 датащи(PDF) 2 Page - Toshiba Semiconductor

номер детали TLP554
подробное описание детали  SIMPLEX/MULTIPLEX DATA TRANSMISSION
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP554 датащи(HTML) 2 Page - Toshiba Semiconductor

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TLP554
2007-10-01
2
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL
MIN.
TYP.
MAX.
UNIT
Low Level input Voltage
VFL
-3
0
1.0
V
High Level input current
IFH
6.3*
20
mA
Supply Voltage
VCC
4.5
5
5.5
V
High-Level Enable Voltage
VEH
2.0
VCC
V
Low-Level Enable Voltage
VEL
0
0.8
V
Fan Out(TTL Load)
N
8
Operating Temperature
Topr
0
70
°C
Note:
Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
*6.3mA condition permits at least 20% CTR degradation
Initial switching threshold is 5.0mA or less.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Forward Current
IF
20
mA
Reverse Voltage
VR
5
V
Output Current
IO
25
mA
Output Voltage
VO
-0.5~7
V
Supply Voltage
(Note 2)
VCC
7
V
Enable Voltage
(Note 3)
VE
5.5
V
Output Power Dissipation
PO
40
mW
Storage Temperature Range
Tstg
−55~125
°C
Operating Temperature Range
Topr
−40~85
°C
Lead Soldering Temperature (10 s)
(Note 4)
Tsol
260
°C
Isolation Voltage (AC, 1 minute, R.H.≤ 60%)
(Note 5)
BVS
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) The VCC supply voltage to each TLP554 isolator must be bypassed by a 0.1μF capacitor or larger.This can
be either a ceramic or solid tantalum capacitor with good high frequency characteristic and should be
connected as close as possible to the package VCC and GND pins each device.
(Note 2) 1 Minute Maximum.
(Note 3) Not to exceed VCC by more than 500mV.
(Note 4) 2mm below seating plane.
(Note 5) Device considered a two-terminal device :Pins 1,2,3 and 4 shorted together,and Pins 5, 6,7 and 8 shorted
together.


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