поискавой системы для электроныых деталей |
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TD62008APG датащи(PDF) 8 Page - Toshiba Semiconductor |
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TD62008APG датащи(HTML) 8 Page - Toshiba Semiconductor |
8 / 10 page TD62008APG/AFG 2007-10-16 8 Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result in injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load. A breakdown could cause a large current to continuously flow and lead to smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings are required, such as fuse capacity, fusing time and insertion circuit location. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result injury by explosion or combustion. In addition, do not use any device that has had current applied even once while inserted in the wrong orientation or incorrectly . (5) Carefully select external components such as power amps and regulators (including input and negative feedback capacitors), and load components such as speakers. If there is a large amount of leakage current, such as from input or negative feedback condensers, the IC output DC voltage will increase. If this output voltage is connected to a speaker with a low input voltage threshold, overcurrent or IC failure could cause smoke or ignition. (The overcurrent can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage directly to a speaker. |
Аналогичный номер детали - TD62008APG |
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Аналогичное описание - TD62008APG |
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