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FGB3040CS датащи(PDF) 1 Page - Fairchild Semiconductor

номер детали FGB3040CS
подробное описание детали  EcoSPARKTM 300mJ, 400V, N-Channel Current Sensing Ignition IGBT
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производитель  FAIRCHILD [Fairchild Semiconductor]
домашняя страница  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FGB3040CS датащи(HTML) 1 Page - Fairchild Semiconductor

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tm
May 2007
@2007 Fairchild Semiconductor Corporation
FGB3040CS Rev. A
www.fairchildsemi.com
1
FGB3040CS
EcoSPARKTM 300mJ, 400V, N-Channel Current Sensing Ignition IGBT
General Description
The FGB3040CS is an lgnition IGBT that offers outstand-
ing SCIS capability along with a ratiometric emitter current
sensing capability. This sensing is based on a emitter
active area ratio of 200:1. The output is provided through a
fourth (sense) lead. This signal provides a current level
that is proportional to the main collector to emitter current.
The effective ratio as measured on the sense lead is a
function of the sense output, the collector current and the
gate to emitter drive voltage.
Applications
Smart Automotive lgnition Coil Driver Circuits
ECU Based Systems
Distributorless Based Systems
Coil on Plug Based Systems
Features
SCIS Energy = 300mJ at TJ = 25oC
Logic Level Gate Drive
Package
Symbol
Device Maximum Ratings T
A = 25°C unless otherwise noted
Symbol
Parameter
Ratings
Units
BVCER
Collector to Emitter Breakdown Voltage (IC = 2mA)
430
V
BVECS
Emitter to Collector Breakdown Voltage (IC = 1mA) (Reverse Battery Condition)
24
V
ESCIS25 Self Clamping Inductive Switching Energy (at starting TJ = 25°C)
300
mJ
ESCIS150 Self Clamping Inductive Switching Energy (at starting TJ = 150°C)
170
mJ
IC25
Continuous Collector Current, at VGE = 4.0V, TC = 25°C
21
A
IC110
Continuous Collector Current, at VGE = 4.0V, TC = 110°C
19
A
VGEM
Maximum Continuous Gate to Emitter Voltage
±10
V
PD
Power Dissipation, at TC = 25°C
150
W
Power Dissipation Derating, for TC > 25oC1
W/oC
TJ
Operating Junction Temperature Range
-40 to 175
oC
TSTG
Storage Junction Temperature Range
-40 to 175
oC
TL
Max. Lead Temp. for Soldering (at 1.6mm from case for 10sec)
300
oC
TPKG
Max. Package Temp. for Soldering (Package Body for 10 sec)
260
oC
ESD
Electrostatic Discharge Voltage, HBM model (100pfd, 1500 ohms)
4
kV
A D
F R E E I


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