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CD74HCT138EE4 датащи(PDF) 8 Page - Texas Instruments

номер детали CD74HCT138EE4
подробное описание детали  High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

CD74HCT138EE4 датащи(HTML) 8 Page - Texas Instruments

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Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD74HCT238EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT238M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT238PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 3


Аналогичный номер детали - CD74HCT138EE4

производительномер деталидатащиподробное описание детали
logo
Texas Instruments
CD74HCT138EE4 TI-CD74HCT138EE4 Datasheet
352Kb / 14P
[Old version datasheet]   High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting
CD74HCT138EE4 TI-CD74HCT138EE4 Datasheet
407Kb / 18P
[Old version datasheet]   High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting
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Аналогичное описание - CD74HCT138EE4

производительномер деталидатащиподробное описание детали
logo
Texas Instruments
CD54HC138 TI-CD54HC138 Datasheet
352Kb / 14P
[Old version datasheet]   High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting
74HC138D-T TI-74HC138D-T Datasheet
765Kb / 19P
[Old version datasheet]   High-Speed CMOS Logic 3- to 8-Line Decoder/Demultiplexer Inverting and Noninverting
CD54HC138 TI-CD54HC138_07 Datasheet
407Kb / 18P
[Old version datasheet]   High-Speed CMOS Logic 3- to 8-Line Decoder/ Demultiplexer Inverting and Noninverting
CD74HC138-Q1 TI1-CD74HC138-Q1 Datasheet
203Kb / 9P
[Old version datasheet]   HIGH-SPEED CMOS LOGIC 3- TO 8-LINE INVERTING DECODER/DEMULTIPLEXER
CD74HC138 TI-CD74HC138 Datasheet
43Kb / 7P
[Old version datasheet]   High Speed CMOS Logic 3-to-8 Line Decoder/ Demultiplexer Inverting and Non-Inverting
logo
NXP Semiconductors
74HC138D-Q100 NXP-74HC138D-Q100 Datasheet
241Kb / 18P
   3-to-8 line decoder/demultiplexer; inverting
Rev. 1-16 July 2012
74AHC138 PHILIPS-74AHC138 Datasheet
84Kb / 16P
   3-to-8 line decoder/demultiplexer; inverting
1999 Sep 27
logo
SHENZHEN FUMAN ELECTRON...
74HC138 FUMAN-74HC138 Datasheet
229Kb / 5P
   3-to-8 Line Decoder/Demultiplexer; Inverting
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NXP Semiconductors
74HC138 PHILIPS-74HC138 Datasheet
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   3-to-8 line decoder/demultiplexer; inverting
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   3-to-8 line decoder/demultiplexer; inverting
Rev. 03-15 November 2007
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