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AD8565AKS-R2 датащи(PDF) 10 Page - Analog Devices |
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AD8565AKS-R2 датащи(HTML) 10 Page - Analog Devices |
10 / 16 page AD8565/AD8566/AD8567 Rev. D | Page 10 of 16 This input current is not inherently damaging to the device as long as it is limited to 5 mA or less. If a condition exists using the AD856x where the input exceeds the supply more than 0.6 V, an external series resistor should be added. The size of the resistor can be calculated by using the maximum overvoltage divided by 5 mA. This resistance should be placed in series with either input exposed to an overvoltage. OUTPUT PHASE REVERSAL The AD856x family is immune to phase reversal. Although the device’s output does not change phase, large currents due to input overvoltage could damage the device. In applications where the possibility of an input voltage exceeding the supply voltage exists, overvoltage protection should be used as described in the Input Overvoltage Protection section. POWER DISSIPATION The maximum allowable internal junction temperature of 150°C limits the AD856x family’s maximum power dissipation of AD856x devices. As the ambient temperature increases, the maximum power dissipated by AD856x devices must decrease linearly to maintain the maximum junction temperature. If this maximum junction temperature is exceeded momentarily, the device still operates properly once the junction temperature is reduced below 150°C. If the maximum junction temperature is exceeded for an extended period, overheating could lead to permanent damage of the device. The maximum safe junction temperature, TJMAX, is 150°C. Using the following formula, the maximum power that an AD856x device can safely dissipate as a function of temperature can be obtained: PDISS = TJMAX − TA/θJA where: PDISS is the AD856x power dissipation. TJMAX is the AD856x maximum allowable junction temperature (150°C). TA is the ambient temperature of the circuit. θJA is the AD856x package thermal resistance, junction-to-ambient. The power dissipated by the device can be calculated as PDISS = (VS − VOUT) × ILOAD where: VS is the supply voltage. VOUT is the output voltage. ILOAD is the output load current. Figure 30 shows the maximum power dissipation vs. temperature. To achieve proper operation, use the previous equation to calculate PDISS for a specific package at any given temperature or use Figure 30. AMBIENT TEMPERATURE (°C) 1.25 0.75 0 –35 0.50 0.25 1.00 –15 5 25 45 65 85 14-LEAD SOIC 5-LEAD SOT-23 8-LEAD MSOP 14-LEAD TSSOP Figure 30. Maximum Power Dissipation vs. Temperature for 5-Lead SC70, 8-Lead MSOP, and 14-Lead TSSOP/SOIC Packages THERMAL PAD—AD8567 The AD8567 LFCSP comes with a thermal pad that is attached to the substrate. This substrate is connected to VDD. To be electrically safe, the thermal pad should be soldered to an area on the board that is electrically isolated or connected to VDD. Attaching the thermal pad to ground adversely affects the performance of the part. Soldering down this thermal pad dramatically improves the heat dissipation of the package. It is necessary to attach vias that connect the soldered thermal pad to another layer on the board. This provides an avenue to dissipate the heat away from the part. Without vias, the heat is isolated directly under the part. |
Аналогичный номер детали - AD8565AKS-R2 |
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Аналогичное описание - AD8565AKS-R2 |
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