MAX8734A datasheet(30/33 Pages) MAXIM

номер детали	MAX8734A

подробное описание детали	High-Efficiency, Quad-Output, Main Power-Supply Controllers for Notebook Computers

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производитель	MAXIM [Maxim Integrated Products]

домашняя страница	https://www.maximintegrated.com/en.html

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30 / 33 page

High-Efficiency, Quad-Output, Main Power-

Supply Controllers for Notebook Computers

30

______________________________________________________________________________________

tion may be required on the secondary output to protect

any device connected to this output.

PC Board Layout Guidelines

Careful PC board layout is critical to achieve minimal

switching losses and clean, stable operation. This is

especially true when multiple converters are on the

same PC board where one circuit can affect the other.

The switching power stages require particular attention

(Figure 13). Refer to the MAX1999 EV kit I.C. data sheet

for a specific layout example.

Mount all of the power components on the top side of

the board with their ground terminals flush against one

another, if possible. Follow these guidelines for good

PC board layout:

• Isolate the power components on the top side from

the sensitive analog components on the bottom side

with a ground shield. Use a separate PGND plane

under the OUT3 and OUT5 sides (called PGND3 and

PGND5). Avoid the introduction of AC currents into

the PGND3 and PGND5 ground planes. Run the

power plane ground currents on the top side only, if

possible.

• Use a star ground connection on the power plane to

minimize the crosstalk between OUT3 and OUT5.

• Keep the high-current paths short, especially at the

ground terminals. This practice is essential for sta-

ble, jitter-free operation.

• Keep the power traces and load connections short.

This practice is essential for high efficiency. Using

thick copper PC boards (2oz vs. 1oz) can enhance

full-load efficiency by 1% or more. Correctly routing

PC board traces must be approached in terms of

fractions of centimeters, where a single milliohm of

excess trace resistance causes a measurable effi-

ciency penalty.

• CS_ (MAX8732A/MAX8733A)/LX_ (MAX8734A) and

GND connections to the synchronous rectifiers for

current limiting must be made using Kelvin-sense

connections to guarantee the current-limit accuracy.

With 8-pin SO MOSFETs, this is best done by routing

power to the MOSFETs from outside using the top

copper layer, while connecting CS_/LX_ traces inside

(underneath) the MOSFETs.

• When trade-offs in trace lengths must be made, it is

preferable to allow the inductor charging path to be

made longer than the discharge path. For example, it

is better to allow some extra distance between the

input capacitors and the high-side MOSFET than to

allow distance between the inductor and the syn-

chronous rectifier or between the inductor and the

output filter capacitor.

• Ensure that the OUT_ connection to COUT_ is short and

direct. However, in some cases it may be desirable to

deliberately introduce some trace length between the

OUT_ connector node and the output filter capacitor

(see the Stability Considerations section).

• Route high-speed switching nodes (BST_, DH_, LX_,

and DL_) away from sensitive analog areas (REF,

ILIM_, and FB_). Use PGND3 and PGND5 as an EMI

shield to keep radiated switching noise away from the

IC’s feedback divider and analog bypass capacitors.

AGND

PGND

VIA TO OUT5

GROUND

OUT3

OUT5

VIA TO OUT3

VIA TO PGND

VIA TO LX5

V+

VIA TO LX3

USE AGND PLANE TO:

- BYPASS VCC AND REF

- TERMINATE EXTERNAL FB

DIVIDER (IF USED)

- TERMINATE RILIM

(IF USED)

- PIN-STRAP CONTROL

INPUTS

USE PGND PLANE TO:

- BYPASS LDO_

- CONNECT PGND TO THE TOPSIDE STAR GROUND

VIAS TO GROUND

NOTE: EXAMPLE SHOWN IS FOR DUAL I.C. n-CHANNEL MOSFET.

ANALOG GROUND

PLANE ON INNER LAYER

C4

C3

C1

N4

N2

C2

L1

L2

CONNECT PGND TO AGND

BENEATH THE CONTROLLER AT

ONE POINT ONLY AS SHOWN.

VIA BETWEEN POWER

AND ANALOG GROUND

N3

N1

Figure 13. PC Board Layout Example

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