METALLURGICALLY BONDED GLASS

SURFACE MOUNT 1.5 WATT ZENERS

SCOTTSD A L E DIVISION

1N5913BUR-1 thru 1N5956BUR-1

(or MLL5913B thru MLL5956B)

DESCRIPTION

APPEARANCE

This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB

package is similar in electrical features to the JEDEC registered 1N5913B

thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection

for applications of high density and low parasitic requirements. Due to its

glass hermetic qualities and metallurgically enhanced internal contacts, it

may also be used for high reliability applications when required by a source

control drawing (SCD) or screening in accordance with MIL-PRF-19500 as

described in Features below. Zener voltage tolerance options are identified

by part number suffix including tight-tolerance. A variety of other Zener

product offerings and packages are available by Microsemi to meet higher

or lower power and test current applications.

DO-213AB

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

• Electrically similar to the JEDEC registered 1N5913B

thru 1N5956B zener series

• Zener voltages available 3.3V to 200V

• Options for screening in accordance with MIL-PRF-

19500 for JAN, JANTX, JANTXV, and JANS are

available by adding MQ, MX, MV, or MSP prefixes

respectively to part numbers, e.g. MX1N5913BUR-1,

MV1N5923CUR-1, MSP1N5952DUR-1, etc.

• Surface mount equivalents also available as

SMBJ5913B to SMBJ5956B, SMBG5913B to

SMBG5956B, SMAJ5913B to SMAJ5956B, or as

1PMT5913B to 1PMT5956B (see separate data

sheets)

• Plastic body axial-leaded Zener equivalents are also

available as 1N5913BP to 1N5956BP (see separate

data sheet)

• Regulates voltage over a broad operating current

and temperature range

• Wide selection from 3.3 to 200 V

• Leadless package for surface mounting

• Ideal for high density mounting

• Metallurgically enhanced internal contact design for

greater reliability and lower thermal resistance

• Standard voltage tolerances are +/- 5% with B suffix

and 10 % with A suffix identification

• Tight tolerances available in plus or minus 2% or

1% with C or D suffix respectively

• Nonsensitive to ESD

• Hermetically sealed glass package

• Specified capacitance (see Figure 2)

• Inherently radiation hard as described in Microsemi

MicroNote 050

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

derating in Figure 1).

120

PC board (1 oz Cu) with recommended footprint (see

last page)

board and recommended footprint as described for

thermal resistance (also see Figure 1)

• Forward voltage @200 mA: 1.2 volts (maximum)

• CASE: Hermetically sealed DO-213AB glass MELF

package

• TERMINALS: End caps, tin-lead plated solderable

per MIL-STD-750, method 2026

• POLARITY: Cathode indicated by band. Diode to

be operated with the banded end positive with

respect to the opposite end for Zener regulation

• MARKING: Cathode band only

• TAPE & REEL optional: Standard per EIA-481-B

with 12 mm tape, 1500 per 7 inch reel or 5000 per

13 inch reel (add “TR” suffix to part number)

• WEIGHT: 0.05 grams

• See package dimensions on last page

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Copyright

 2005

1-04-2005 REV D