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DATA BRIEFING

September 2001

This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact

your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29.

SMARTCARD MCU

Ordering Information

For Package And Delivery

INTRODUCTION

The manufacturing process of Smartcards in-

volves various components and technologies in

order to issue a finished product:

– micromodules,

– flat packages,

– wafers.

s

MICROMODULES

Dedicated package for Smartcard products, the

micromodule type depends on the size of the

product and on the application.

Table 1 lists all available micromodules.

s

FLAT PACKAGES

For applications which require surface mount tech-

nology, suitable for PC cards, or other security

modules, STMicroelectronics offers flat packages

listed In Table 2.

s

WAFERS

For issuer production need, ST offers sawn and

unsawn wafers deliveries, listed in Table 3.

Figure 1. Delivery form

Table 1. Micromodules in super 35 standard

tape

Table 2. Flat Packages

Table 3. Wafers

SO20

261a.ai

8” Wafer

Micromodule

Notch

Type

Description

D1, D2

8 contacts for memory cards

D15

6 contacts for memory cards

D3, D4

8 contacts with ring MCU cards

D5

8 contacts for dual contact contactless

MCU cards

D68

8 contacts for MCU cards

D7

6 contacts for dual contact contactless

MCU cards

C7

Full contactless for MCU cards

D8

8 contacts for MCU cards

Type

Description

O20

SO20 for MCU products

QF4

TQFP44 for MCU products

R20

SO20 on tape and reel for MCU products

Type

Description

W00

Unsawn wafers, 750 µm thickness

W20

Unsawn wafers, 275 µm thickness

W40

Unsawn wafers, 180 µm thickness

S2x

280 µm sawn wafers on UV tape

R4x

180 µm sawn wafers on insolated UV tape

S4x

180 µm sawn wafers on UV tape

T4x

180 µm sawn wafers on blue tape