©2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

6N137, HCPL2601, HCPL2611, HCPL2630, HCPL2631 Rev. 1.0.7

9

Package Dimensions

Through Hole

Surface Mount

Note:

All dimensions are in inches (millimeters)

0.4" Lead Spacing

8-Pin DIP – Land Pattern

0.200 (5.08)

0.140 (3.55)

0.100 (2.54) TYP

0.022 (0.56)

0.016 (0.41)

0.020 (0.51) MIN

0.390 (9.91)

0.370 (9.40)

0.270 (6.86)

0.250 (6.35)

3

0.070 (1.78)

0.045 (1.14)

2

41

56

7

8

0.300 (7.62)

TYP

0.154 (3.90)

0.120 (3.05)

0.016 (0.40)

0.008 (0.20)

15

° MAX

PIN 1

ID.

Lead Coplanarity : 0.004 (0.10) MAX

0.270 (6.86)

0.250 (6.35)

0.390 (9.91)

0.370 (9.40)

0.022 (0.56)

0.016 (0.41)

0.100 (2.54)

TYP

0.020 (0.51)

MIN

0.070 (1.78)

0.045 (1.14)

0.300 (7.62)

TYP

0.405 (10.30)

MAX.

0.315 (8.00)

MIN

0.045 (1.14)

32

1

4

56

7

8

0.016 (0.41)

0.008 (0.20)

PIN 1

ID.

0.200 (5.08)

0.140 (3.55)

0.100 (2.54) TYP

0.022 (0.56)

0.016 (0.41)

0.004 (0.10) MIN

0.390 (9.91)

0.370 (9.40)

0.270 (6.86)

0.250 (6.35)

3

0.070 (1.78)

0.045 (1.14)

2

41

56

7

8

0.400 (10.16)

TYP

0.154 (3.90)

0.120 (3.05)

0.016 (0.40)

0.008 (0.20)

0

° to 15°

PIN 1

ID.

0.070 (1.78)

0.060 (1.52)

0.030 (0.76)

0.100 (2.54)

0.295 (7.49)

0.415 (10.54)