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STP15NK50ZFP датащи(PDF) 4 Page - STMicroelectronics |
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STP15NK50ZFP датащи(HTML) 4 Page - STMicroelectronics |
4 / 19 page Electrical ratings STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 - STW15NK50Z 4/19 Rthj-a Thermal resistance junction-ambient max 62.5 50 °C/W Tl Maximum lead temperature for soldering purpose 300 °C 1. When mounted on minimum foot-print Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) 14 A EAS Single pulse avalanche energy (starting Tj=25°C, Id=IAR, VDD=50V) 300 mJ Table 4. Gate-source zener diode Symbol Parameter Test conditions Min. Typ. Max. Unit BVGSO (1) 1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Gate-source breakdown voltage Igs=±1mA (Open Drain) 30 V Table 2. Thermal data |
Аналогичный номер детали - STP15NK50ZFP |
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Аналогичное описание - STP15NK50ZFP |
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