Figure 4 :

Example of P.C. Board Copper Area

which is Used as Heatsink

Figure 5 :

External Heatsink Mounting Example

MOUNTING INSTRUCTIONS

soldering the GND pins to a suitable copper area

of the printed circuit board (fig. 4) or to an external

heatsink (fig. 5).

The diagram of figure 6 shows the maximum dissi-

the side”l” of two equal square copper areas having

a thickness of 35

µ (1.4 mils).

During soldering the pins temperature must not

exceed 260

°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

Figure 6 :

Maximum Dissipable Power and Junc-

tion to Ambient Thermal Resistance

versus Side ”l”

Figure 7 :

Maximum Allowable Power Dissipa-

tion versus Ambient Temperature

TDA2270

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