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ADV3203ASWZ датащи(PDF) 6 Page - Analog Devices |
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ADV3203ASWZ датащи(HTML) 6 Page - Analog Devices |
6 / 20 page ADV3202/ADV3203 Rev. 0 | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION Table 5. Parameter Rating Analog Supply Voltage (VPOS − VNEG) 7.5 V Digital Supply Voltage (DVCC − DGND) 6 V Ground Potential Difference (VNEG − DGND) +0.5 V to –4 V Maximum Potential Difference DVCC − VNEG 9.4 V Disabled Outputs ADV3202 (|VOSD − VOUT|) <3 V ADV3203 (|VOSD −(VOUT+VREF)/2|) <3 V |VCLAMP − VINxx| 6 V VREF Input Voltage ADV3202 VPOS – 3.5 V to VNEG + 3.5 V ADV3203 VPOS – 4 V to VNEG + 4 V Analog Input Voltage VNEG to VPOS Digital Input Voltage DVCC Output Voltage (Disabled Analog Output) (VPOS − 1 V) to (VNEG + 1 V) Output Short-Circuit Duration Momentary Output Short-Circuit Current 45 mA Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C The ADV3202/ADV3203 are operated with ±2.5 V, +5 V, or ±3.3 V supplies and can drive loads down to 150 Ω, resulting in a large range of possible power dissipations. For this reason, extra care must be taken while derating the operating conditions based on ambient temperature. Packaged in a 176-lead exposed-pad LQFP, the ADV3202/ ADV3203 junction-to-ambient thermal impedance (θJA) is 16°C/W. For long-term reliability, the maximum allowed junction temperature of the die should not exceed 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. Figure 3 shows the range of allowed internal die power dissipations that meet these conditions over the −40°C to +85°C ambient temperature range. When using Figure 3, do not include external load power in the maximum power calculation, but do include load current dropped on the die output transistors. 9 8 7 6 5 4 3 15 25 35 45 55 65 75 85 AMBIENT TEMPERATURE (°C) TJ = 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 3. Maximum Die Power Dissipation vs. Ambient Temperature THERMAL RESISTANCE ESD CAUTION θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type θJA Unit 176-Lead LQFP_EP 16 °C/W |
Аналогичный номер детали - ADV3203ASWZ |
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Аналогичное описание - ADV3203ASWZ |
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