поискавой системы для электроныых деталей |
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LC03-3.3.TBT датащи(PDF) 4 Page - Semtech Corporation |
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LC03-3.3.TBT датащи(HTML) 4 Page - Semtech Corporation |
4 / 7 page 4 2004 Semtech Corp. www.semtech.com PRELIMINARY PROTECTION PRODUCTS LC03-3.3 Connection for Differential (Line-to-Line) and Com- mon Mode Protection (Line-to-Ground) Device Connection Options for Protection of Two High-Speed Data Lines The LC03-3.3 is designed to protect two high-speed data lines (one differential pair) from transient over- voltages which result from lightning and ESD. The device can be configured to protect in differential (Line- to-Line) and common (Line-to-Ground) mode. Data line inputs/outputs are connected at pins 1 to 8, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected. Connection for Differential Protection (Line-to-Line) Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. |
Аналогичный номер детали - LC03-3.3.TBT |
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Аналогичное описание - LC03-3.3.TBT |
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