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LCDA15C-6.T датащи(PDF) 4 Page - Semtech Corporation |
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LCDA15C-6.T датащи(HTML) 4 Page - Semtech Corporation |
4 / 6 page 4 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PROTECTION PRODUCTS LCDA15C-6 Device Connection Multi-Mode Tranceiver Protection Example Device Connection Options for Protection of Six High- Speed Data Lines The LCDA15C-6 may be configured to protect up to six I/O lines operating between 5 and 15V. It may be used to protect the most popular serial data interface standard lines making it ideal for use in equipment utilizing multi-mode transceivers. Data lines are connected at pins 1, 2, 3, 6, 7, and 8. Pins 4 and 5 are connected to ground. For best results, these pins should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Multi-Mode Transceiver Protection A typical multi-mode transceiver protection circuit is shown. The LCDA15C-6 is used to protect I/O lines with external connections. The LCDA15C-6 adds a maximum loading capacitance of 15pF with a working voltage of 15V. This allows the transceiver to safely operate in all modes without clipping or degradation of the signal. With proper design and layout, the transceiver port can be protected to >15kV (HBM per IEC 61000-4-2). Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: Place the LCDA15C-6 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the LCDA15C-6 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. |
Аналогичный номер детали - LCDA15C-6.T |
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Аналогичное описание - LCDA15C-6.T |
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