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CS485XX датащи(PDF) 11 Page - Cirrus Logic |
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CS485XX датащи(HTML) 11 Page - Cirrus Logic |
11 / 26 page CS485xx Family Data Sheet 32-bit Audio Decoder DSP Family DS734F3 Copyright 2009 Cirrus Logic, Inc. 11 CONFIDENTIAL 5.4 Power Supply Characteristics (Measurements performed under operating conditions) 5.5 Thermal Data (48-Pin LQFP) 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top & bottom layers. 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top & bottom layers and 0.5-oz. copper covering 90 % of the internal power plane & ground plane layers. 3. To calculate the die temperature for a given power dissipation T j = Ambient Temperature + [ (Power Dissipation in Watts) * θ ja ] 4. To calculate the case temperature for a given power dissipation T c = Tj - [ (Power Dissipation in Watts) * ψ jt ] Parameter Min Typ Max Unit Operational Power Supply Current: VDD: Core and I/O operating1 VDDA: PLL operating VDDIO: With most ports operating Total Operational Power Dissipation: Standby Power Supply Current: VDD: Core and I/O not clocked VDDA: PLL halted VDDIO: All connected I/O pins 3-stated by other ICs in system Total Standby Power Dissipation: 1. Dependent on application firmware and DSP clock speed. - - - - - - - 203 8 27 480 100 1 50 348 - - - - - - - mA mA mA mW μA μA μA μW Parameter Symbol Min Typ Max Unit Junction Temperature Tj - - 125 °C Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 63.5 54 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board3 Four-layer Board4 ψ jt - - 0.70 0.64 - - °C / Watt |
Аналогичный номер детали - CS485XX |
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Аналогичное описание - CS485XX |
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