поискавой системы для электроныых деталей |
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LA112B-YG.G-1-PF датащи(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA112B-YG.G-1-PF датащи(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test Low Temperature Storage Test Solderability Test Thermal Shock Test Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=85 ℃ 2.RH=85% 3.t=240hrs ±2hrs The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 Reliability Test: Test Item High Temperature Storage Test Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LA112B/YG.G-1-PF |
Аналогичный номер детали - LA112B-YG.G-1-PF |
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Аналогичное описание - LA112B-YG.G-1-PF |
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