поискавой системы для электроныых деталей |
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LA209B-1-3XYXGX-PF датащи(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA209B-1-3XYXGX-PF датащи(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page The purpose of this test is the resistance of the device under tropical for hous. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only High Temperature Storage Test Operating Life Test Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test Item PART NO. Test Condition The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Description Reference Standard 6/6 Page LA209B-1/3XYXGX-PF |
Аналогичный номер детали - LA209B-1-3XYXGX-PF |
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Аналогичное описание - LA209B-1-3XYXGX-PF |
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