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BD35281HFN датащи(PDF) 4 Page - Rohm

номер детали BD35281HFN
подробное описание детали  Silicon Monolithic Integrated Circuit
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производитель  ROHM [Rohm]
домашняя страница  http://www.rohm.com
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REV. A
○NOTES FOR USE
(1) Absolute maximum range
Although the quality of this product is rigorously controlled, and circuit operation is guaranteed within the operation ambient temperature range, the
device may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because the failure mode (such as
short mode or open mode) cannot be identified in this instance, it is important to take physical safety measures such as fusing if a specific mode in
excess of absolute rating limits is considered for implementation.
(2) Ground potential
Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode, including transient
conditions.
(3) Thermal Design
Provide sufficient margin in the thermal design to account for the allowable power dissipation (Pd) expected in actual use.
(4) Using in the strong electromagnetic field
Use in strong electromagnetic fields may cause malfunctions.
(5) ASO
Be sure that the output transistor for this IC does not exceed the absolute maximum ratings or ASO value.
(6)
Thermal shutdown circuit
The IC is provided with a built-in thermal shutdown (TSD) circuit. When chip temperature reaches the threshold temperature shown below, output
goes to a cut-off state. (This IC latches output to off mode when the temperature recedes to the specified level. To release latch mode, EN or Vcc is
re-operated.) Note that the TSD circuit is designed exclusively to shut down the IC in abnormal thermal conditions.
It is not intended to protect the
IC or guarantee performance when extreme heat occurs. Therefore, the TSD circuit should not be employed with the expectation of continued use or
subsequent operation once TSD is operated.
(7) GND pattern
When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to
separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not
cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external
component GND.
(8) Output Capacitor (C3)
Mount an output capacitor between Vo and GND for stability purposes. The output capacitor is for the open loop gain phase compensation and
reduces the output voltage load regulation. If the capacitor value is not large enough, the output voltage may oscillate. And if the equivalent series
resistance (ESR) is too large, the output voltage rise/drop increases during a sudden load change. A Low ESR22uF capacitor is recommended.
However, the stability depends on the characteristics of temperature and load. And if several kinds of capacitors are utilized in parallel, the output
voltage may oscillate due to lack of phase margin. Please confirm operation across a variety of temperature and load conditions.
(9) Input Capacitor (C1, C2)
The input capacitor reduces the output impedence of the voltage supply source connected in the VCC and VIN. If the output impedence of this power
supply increases, the input voltage (VCC,VIN) may become unstable. This may result in the output voltage oscillation or lowering ripple rejection.
Stability depends on power supply characteristics and the substrate wiring pattern. Please confirm operation across a variety of temperature and load
conditions.
(10) NRCS (Non Rush Current on Start-up) Setting(CNRCS)
The NRCS function is built in this IC to prevent rush current from going through the load (VIN to VO) for start-up. The constant current comes from the
NRCS pin when EN is high or UVLO function is deactivated. Temporary reference voltage is made proportional to time due to current charge the
NRCS pin capacitor and make output voltage start up proportional to this reference volatge. To obtain a stable NRCS delay time, a 0.001μF~1μF
capacitor (X5R or X7R) with susceptiblity to temperature is recommended.
(11) SCP (Short Circuit Protection)
Timer latch short circuit protection function is built in the IC. (NRCS is also working at the same time.) to protect the break down of the power
MOSFET caused by rush current when the output is shorted to GND. This function becomes active and latches the status when the output voltage
level goes under by 40% of specified VO. In this case, start VCC or EN up again to deactive this latch function.
(12) Input Terminal (VCC,VIN)
The EN, VIN, and VCC are isolated. The UVLO protects incorrect operation when the voltage level of VIN and VCC are low. The output becomes high
when these pins reach the individual threshold level independent of the start-up pin order. However, if VIN shut down while the IC works under the
normal operation, SCP function becomes active and latches the status. And the output does not come back active even though VIN goes up high again.
In this case, start VCC up again to deactive this latch function.
(13) Heat sink (FIN)
Since the heat sink (FIN) is connected with the Sub, short it to the GND. It is possible to minimize the thermal resistance by soldering it to GND plane
of PCB.
(14) Please add a protection diode when a large inductance component is connected to the
output terminal, and reverse-polarity power is possible at startup or in output OFF
condition.
(15) Short-circuits between pins and and mounting errors
Do not short-circuit between output pin (Vo) and supply pin (Vcc) or ground (GND), or between supply pin (Vcc) and ground (GND). Mounting errors,
such as incorrect positioning or orientation, may destroy the device.
Mounting errors, such as incorrect positioning or orientation, may destroy the device.
(16)
Each block of this IC contains logic circuits which can pull an instantaneous amount of rush current when switching. Therefore, special consideration
should be given to the power supply coupling capacitance and the width of power supply and ground traces. Avoid excessively long or convoluted
trace patterns.
TSD ON temperature [℃]
(typ.)
175
(Example)
OUTPUT
PIN


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