© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5341 • Rev. 1.0.0

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above

the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended

exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings

are stress ratings only.

Symbol Parameter

Min.

Max.

Units

VIN

-0.3

6.0

V

FB, EN Pins

-0.3

V

SW Pin

-0.3

22.0

V

VOUT Pin

–0.3

22.0

V

ESD

Electrostatic Discharge Protection

Level

Human Body Model per JESD22-A114

3.3

kV

Charged Device Model per JESD22-C101

2.0

Junction Temperature

-40

+150

°C

Storage Temperature

-65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding

them or designing to absolute maximum ratings.

Symbol

Parameter

Comments

Min.

Max.

Units

VIN Supply Voltage

2.7

5.5

V

VOUT Voltage

(1)

6.2

17.5

V

VOUT Load Current

500mW Maximum Output Power

5

25

mA

Ambient Temperature

-40

+85

°C

Junction Temperature

-40

+125

°C

Note:

1.

Application should guarantee that minimum and maximum duty-cycle should fall between 20-85% to meet the specified

range

Thermal Properties

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p

Symbol Parameter

Typical

Units

Junction-to-Ambient Thermal Resistance, UMLP6 Package

70

°C/W