поискавой системы для электроныых деталей |
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SN74AUC1G74DCURE4 датащи(PDF) 2 Page - Texas Instruments |
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SN74AUC1G74DCURE4 датащи(HTML) 2 Page - Texas Instruments |
2 / 16 page www.ti.com TG C C TG C C TG C C C TG C C CLR CLK D PRE Q Q C 6 2 7 3 5 1 SN74AUC1G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET SCES537D – DECEMBER 2003 – REVISED JUNE 2007 ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUC1G74YZPR 0.23-mm Large Bump – YZP (Pb-free) _ _ _UP_ NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUC1G74YZTR 0.23-mm Large Bump – YZT (Pb-free) –40 °C to 85°C QFN – RSE Reel of 3000 SN74AUC1G74RSER UP SSOP – DCT Reel of 3000 SN74AUC1G74DCTR U74_ _ _ VSSOP – DCU Reel of 3000 SN74AUC1G74DCUR U74_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS OUTPUTS PRE CLR CLK D Q Q L H X X H L X L X X L H H H ↑ H H L H H ↑ L L H H H L X Q0 Q 0 LOGIC DIAGRAM (POSITIVE LOGIC) A. Pin numbers shown are for the DCT, DCU, YZP, and YZT packages only. 2 Submit Documentation Feedback |
Аналогичный номер детали - SN74AUC1G74DCURE4 |
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Аналогичное описание - SN74AUC1G74DCURE4 |
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