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ISL12020MIRZ-T датащи(PDF) 5 Page - Intersil Corporation

номер детали ISL12020MIRZ-T
подробное описание детали  Low Power RTC with Battery Backed SRAM, Integrated 짹5ppm Temperature Compensation and Auto Daylight Saving
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производитель  INTERSIL [Intersil Corporation]
домашняя страница  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL12020MIRZ-T датащи(HTML) 5 Page - Intersil Corporation

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5
FN6667.4
February 11, 2010
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT and IRQ/FOUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . -0.3V to VDD + 0.3V
Voltage on X1 and X2 pins
(respect to ground, Note 6) . . . . . . . . . . . -0.3V to 2.5V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . .>300V
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
20 Lead DFN (Notes 4, 5) . . . . . 40
3.5
Storage Temperature . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note 7) . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. The X1 and X2 pins are connected internally to a crystal and should be a floating electrical connection.
7. The ISL12020M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on
the reflow temperature and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and
time as short as possible. Changes on the order of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics - RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise
stated. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 8)
TYP
(Note 9)
MAX
(Note 8) UNITS NOTES
VDD
Main Power Supply
(Note 10)
2.7
5.5
V
VBAT
Battery Supply Voltage
(Note 10)
1.8
5.5
V11
IDD1
Supply Current. (I2Cnot active,
temperature conversion not active,
FOUT not active)
VDD = 5V
4.1
7
µA
12, 13
VDD = 3V
3.5
6
µA
12, 13
IDD2
Supply Current. (I2C active,
temperature conversion not active,
FOUT not active)
VDD = 5V
200
500
µA
12, 13
IDD3
Supply Current. (I2Cnot active,
temperature conversion active,
FOUT not active)
VDD = 5V
120
400
µA
12, 13
IBAT
Battery Supply Current
VDD = 0V, VBAT = 3V,
TA =+25°C
1.0
1.6
µA
12
VDD = 0V, VBAT = 3V
1.0
5.0
µA
12
IBATLKG Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
ILI
Input Leakage Current on SCL
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
µA
ILO
I/O Leakage Current on SDA
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
µA
VBATM
Battery Level Monitor Threshold
-100
+100
mV
VPBM
Brownout Level Monitor Threshold
-100
+100
mV
VTRIP
VBAT Mode Threshold
(Note 10)
2.0
2.2
2.4
V
VTRIPHYS VTRIP Hysteresis
30
mV
15
VBATHYS VBAT Hysteresis
50
mV
15
Fout25°C Oscillator Initial Accuracy
VDD = 3.3V, TA = +25°C
±2
ppm
7, 15
ΔFoutT Oscillator Stability vs Temperature VDD = 3.3V
-5
+5
ppm
7, 15
ΔFoutV Oscillator Stability vs Voltage
2.7V ≤ VDD ≤ 5.5V
-3
+3
ppm
15
Temperature Sensor Accuracy
VDD = VBAT = 3.3V
±2
°C
15
ISL12020M


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