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LM3445 датащи(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
номер детали LM3445
подробное описание детали  Triac Dimmable Offline LED Driver
Download  26 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3445 датащи(HTML) 4 Page - National Semiconductor (TI)

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background image
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CURRENT SENSE COMPARATOR
V
FLTR2
FLTR2 open circuit voltage
720
750
780
mV
R
FLTR2
FLTR2 impedance
420
k
V
OS
Current sense comparator offset voltage
-4.0
0.1
4.0
mV
GATE DRIVE OUTPUT
V
DRVH
GATE high saturation
I
GATE = 50 mA
0.24
0.50
V
V
DRVL
GATE low saturation
I
GATE = 100 mA
0.22
0.50
I
DRV
Peak souce current
GATE = V
CC/2
-0.77
A
Peak sink current
GATE = V
CC/2
0.88
t
DV
Rise time
C
load = 1 nF
15
ns
Fall time
C
load = 1 nF
15
THERMAL SHUTDOWN
T
SD
Thermal shutdown temperature
(Note 4)
165
°C
Thermal shutdown hysteresis
20
THERMAL SHUTDOWN
RθJA
MSOP-10 junction to ambient
121
°C/W
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
All voltages are with respect to the potential at the GND pin, unless otherwise specified.
Note 2: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J = 165°C (typ.) and disengages at TJ
= 145°C (typ).
Note 3: Human Body Model, applicable std. JESD22-A114-C.
Note 4: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation and/or poor package thermal resistance is
present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (T
A-MAX) is dependent on the maximum operating junction
temperature (T
J-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
www.national.com
4


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